TC74HC165AF(TP1) vs 74HC165D-Q100 feature comparison

TC74HC165AF(TP1) Toshiba America Electronic Components

Buy Now Datasheet

74HC165D-Q100 NXP Semiconductors

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, 3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16
Pin Count 16 16
Reach Compliance Code unknown unknown
Additional Feature CLOCK INHIBIT
Count Direction RIGHT RIGHT
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e4
Length 10.3 mm 9.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type PARALLEL IN SERIAL OUT PARALLEL IN SERIAL OUT
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Propagation Delay (tpd) 38 ns 250 ns
Qualification Status Not Qualified
Seated Height-Max 1.9 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm 3.9 mm
fmax-Min 24 MHz 24 MHz
Base Number Matches 3 2
HTS Code 8542.39.00.01
Moisture Sensitivity Level 1
Screening Level AEC-Q100

Compare TC74HC165AF(TP1) with alternatives

Compare 74HC165D-Q100 with alternatives