TC74HC151AF(TP2)
vs
MM74HC251SJX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TOSHIBA CORP
ON SEMICONDUCTOR
Part Package Code
SOIC
Package Description
0.300 INCH, PLASTIC, SOP-16
SOP,
Pin Count
16
Reach Compliance Code
unknown
compliant
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
e3
Length
10.3 mm
10.1 mm
Load Capacitance (CL)
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
1
1
Number of Inputs
8
8
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
240
Propagation Delay (tpd)
45 ns
256 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.9 mm
2.1 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
5.3 mm
5.3 mm
Base Number Matches
1
2
HTS Code
8542.39.00.01
Moisture Sensitivity Level
1
Output Characteristics
3-STATE
Compare TC74HC151AF(TP2) with alternatives
Compare MM74HC251SJX with alternatives