TC74HC123F vs HD74HC123AFP feature comparison

TC74HC123F Toshiba America Electronic Components

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HD74HC123AFP Renesas Electronics Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer TOSHIBA CORP RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0
Length 10.3 mm 10.06 mm
Logic IC Type MONOSTABLE MULTIVIBRATOR MONOSTABLE MULTIVIBRATOR
Number of Data/Clock Inputs 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 300 ns 300 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm 2.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 2 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 2
Pbfree Code Yes
Date Of Intro 1987-05-01
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 20
Width 5.5 mm

Compare TC74HC123F with alternatives

Compare HD74HC123AFP with alternatives