TC74HC11AF-EL vs HD74HC11FP feature comparison

TC74HC11AF-EL Toshiba America Electronic Components

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HD74HC11FP Hitachi Ltd

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP HITACHI LTD
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0
Length 10.3 mm 10.06 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 21 ns 125 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 2.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm 5.5 mm
Base Number Matches 3 2
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.3
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 25 ns
Schmitt Trigger NO
Time@Peak Reflow Temperature-Max (s) 20

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