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TC74HC109AFN-ELP vs 74HC109D,653 feature comparison

TC74HC109AFN-ELP Toshiba America Electronic Components

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74HC109D,653 NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC SOP
Package Description SOP, SOT-109, SO-16
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e4
Length 9.9 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type J-KBAR FLIP-FLOP J-KBAR FLIP-FLOP
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 38 ns 265 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 3.9 mm 3.9 mm
fmax-Min 25 MHz 24 MHz
Base Number Matches 1 2
Manufacturer Package Code SOT109-1
Factory Lead Time 4 Weeks
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Logic » FF/Latches
Logic » FF/Latches

Compare TC74HC109AFN-ELP with alternatives

Compare 74HC109D,653 with alternatives