TC74HC00AFN vs SN74HC00-W feature comparison

TC74HC00AFN Toshiba America Electronic Components

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SN74HC00-W Texas Instruments

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Pbfree Code Yes No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC WAFER
Package Description SOP, SOP14,.25 DIE,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba
Additional Feature NOT AVAILABLE IN JAPAN
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-XUUC-N
JESD-609 Code e0
Length 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP DIE
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE UNCASED CHIP
Prop. Delay@Nom-Sup 19 ns
Propagation Delay (tpd) 95 ns 115 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL UPPER
Width 3.9 mm
Base Number Matches 2 1

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