TC74ACT157FN vs 5962H9655302VXC feature comparison

TC74ACT157FN Toshiba America Electronic Components

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5962H9655302VXC Cobham Semiconductor Solutions

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP AEROFLEX COLORADO SPRINGS
Part Package Code SOIC DFP
Package Description SOP, SOP16,.25 DFP,
Pin Count 16 16
Reach Compliance Code unknown unknown
Additional Feature NOT AVAILABLE IN JAPAN
Family ACT ACT
JESD-30 Code R-PDSO-G16 R-CDFP-F16
Length 9.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.024 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOP DFP
Package Equivalence Code SOP16,.25 FL16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE FLATPACK
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 9.1 ns
Propagation Delay (tpd) 9.1 ns 20 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 2.921 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm
Base Number Matches 1 3
HTS Code 8542.39.00.01
JESD-609 Code e4
Screening Level MIL-PRF-38535 Class V
Terminal Finish GOLD
Total Dose 1M Rad(Si) V

Compare TC74ACT157FN with alternatives

Compare 5962H9655302VXC with alternatives