TC74AC32F(TP1) vs HD74AC32FP feature comparison

TC74AC32F(TP1) Toshiba America Electronic Components

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HD74AC32FP Hitachi Ltd

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Part Life Cycle Code End Of Life Transferred
Ihs Manufacturer TOSHIBA CORP HITACHI LTD
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AC AC
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 10.3 mm 10.06 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Max I(ol) 0.024 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.3 SOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Power Supply Current-Max (ICC) 0.04 mA
Prop. Delay@Nom-Sup 8.5 ns 10 ns
Propagation Delay (tpd) 11.9 ns 10 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.9 mm 2.2 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 2 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm 5.5 mm
Base Number Matches 1 2
Rohs Code Yes
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 20

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