TC74AC258F(TP1)
vs
DM54LS151W-MLS
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
End Of Life
Obsolete
Ihs Manufacturer
TOSHIBA CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
Package Description
SOP,
DFP,
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
AC
LS
JESD-30 Code
R-PDSO-G16
R-GDFP-F16
JESD-609 Code
e0
Length
10.3 mm
9.6645 mm
Load Capacitance (CL)
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.024 A
Number of Functions
4
1
Number of Inputs
2
8
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
Output Polarity
INVERTED
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
FLATPACK
Power Supply Current-Max (ICC)
0.08 mA
Propagation Delay (tpd)
10.4 ns
40 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.9 mm
2.032 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
TTL
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
5.3 mm
6.604 mm
Base Number Matches
1
1
Compare TC74AC258F(TP1) with alternatives
Compare DM54LS151W-MLS with alternatives