TC74AC258F(TP1)
vs
AM2922LCB
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
End Of Life
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
SOIC
|
QLCC
|
| Package Description |
SOP,
|
QCCN,
|
| Pin Count |
16
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
AC
|
S
|
| JESD-30 Code |
R-PDSO-G16
|
S-CQCC-N20
|
| JESD-609 Code |
e0
|
|
| Length |
10.3 mm
|
8.89 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.024 A
|
|
| Number of Functions |
4
|
1
|
| Number of Inputs |
2
|
8
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
INVERTED
|
CONFIGURABLE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
QCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Power Supply Current-Max (ICC) |
0.08 mA
|
148 mA
|
| Propagation Delay (tpd) |
10.4 ns
|
35 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.9 mm
|
2.54 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
5.3 mm
|
8.89 mm
|
| Base Number Matches |
1
|
1
|
| Package Equivalence Code |
|
LCC20,.35SQ
|
|
|
|
Compare TC74AC258F(TP1) with alternatives
Compare AM2922LCB with alternatives