TC74AC169FN
vs
54AC169JRQMLV
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
Package Description
SOP, SOP16,.25
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
TCO OUTPUT
Count Direction
BIDIRECTIONAL
BIDIRECTIONAL
Family
AC
AC
JESD-30 Code
R-PDSO-G16
R-GDIP-T16
JESD-609 Code
e0
e0
Length
9.9 mm
19.43 mm
Load Capacitance (CL)
50 pF
50 pF
Load/Preset Input
YES
YES
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Max I(ol)
0.024 A
0.012 A
Mode of Operation
SYNCHRONOUS
SYNCHRONOUS
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.25
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Power Supply Current-Max (ICC)
0.08 mA
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
3.9 mm
7.62 mm
Base Number Matches
3
1
Moisture Sensitivity Level
1
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
16.5 ns
Screening Level
MIL-PRF-38535 Class V
Time@Peak Reflow Temperature-Max (s)
40
Total Dose
100k Rad(Si) V
fmax-Min
75 MHz
Compare TC74AC169FN with alternatives
Compare 54AC169JRQMLV with alternatives