TC74AC157FS vs HD74HC251T feature comparison

TC74AC157FS Toshiba America Electronic Components

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HD74HC251T Renesas Electronics Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer TOSHIBA CORP RENESAS ELECTRONICS CORP
Part Package Code SOIC TSSOP
Package Description 0.225 INCH, PLASTIC, SSOP-16 TSSOP,
Pin Count 16 16
Reach Compliance Code unknown compliant
Family AC HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0
Length 5 mm 5 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 1
Number of Inputs 2 8
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 16.7 ns 51 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4.4 mm 4.4 mm
Base Number Matches 1 2
HTS Code 8542.39.00.01
Output Characteristics 3-STATE
Supply Voltage-Nom (Vsup) 5 V

Compare TC74AC157FS with alternatives

Compare HD74HC251T with alternatives