TC74AC10FN-ELP vs MC74AC10DR2G feature comparison

TC74AC10FN-ELP Toshiba America Electronic Components

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MC74AC10DR2G onsemi

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer TOSHIBA CORP ONSEMI
Part Package Code SOIC SOIC-14 NB
Package Description SOP, SOIC-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 50 OHM LINE DRIVE CAPABILITY FOR < = 10MS ONE O/P AT A TIME
Family AC AC
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.024 A
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Power Supply Current-Max (ICC) 0.08 mA
Propagation Delay (tpd) 9.9 ns 10.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Pbfree Code Yes
Manufacturer Package Code 751A-03
Factory Lead Time 12 Weeks
Samacsys Manufacturer onsemi
JESD-609 Code e3
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 10.5 ns
Schmitt Trigger NO
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30

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Compare MC74AC10DR2G with alternatives