TC7404UBP
vs
74F10DC
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP,
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
TTL/H/L
F/FAST
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
JESD-609 Code
e0
e0
Length
19.43 mm
19.43 mm
Logic IC Type
INVERTER
NAND GATE
Number of Functions
6
3
Number of Inputs
1
3
Number of Terminals
14
14
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
150 ns
5.3 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5 mm
5.08 mm
Supply Voltage-Max (Vsup)
18 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
TTL
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Pbfree Code
No
Load Capacitance (CL)
50 pF
Max I(ol)
0.02 A
Power Supply Current-Max (ICC)
7.7 mA
Prop. Delay@Nom-Sup
6 ns
Schmitt Trigger
NO
Compare TC7404UBP with alternatives
Compare 74F10DC with alternatives