TC648EOA713
vs
TC648VPA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
TELCOM SEMICONDUCTOR INC
Part Package Code
SOIC
Package Description
0.150 INCH, PLASTIC, SOIC-8
PLASTIC, DIP-8
Pin Count
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Factory Lead Time
6 Weeks
Samacsys Manufacturer
Microchip
Analog IC - Other Type
BRUSHLESS DC MOTOR CONTROLLER
BRUSHLESS DC MOTOR CONTROLLER
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
JESD-609 Code
e3
e0
Length
4.9 mm
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP8,.25
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Screening Level
TS 16949
Seated Height-Max
1.75 mm
Supply Current-Max (Isup)
1 mA
1 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
Matte Tin (Sn)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
3.9 mm
Base Number Matches
1
2
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