TC622EPA
vs
TC622VPA
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
TELCOM SEMICONDUCTOR INC
|
TELCOM SEMICONDUCTOR INC
|
Package Description |
DIP8,.3
|
PLASTIC, DIP-8
|
Reach Compliance Code |
unknown
|
unknown
|
Accuracy-Max (Cel) |
5 Cel
|
5 Cel
|
Body Breadth |
6.35 mm
|
6.35 mm
|
Body Height |
4.32 mm
|
4.32 mm
|
Body Length or Diameter |
9.5 mm
|
9.5 mm
|
Housing |
PLASTIC
|
PLASTIC
|
JESD-609 Code |
e0
|
e0
|
Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
Number of Terminals |
8
|
8
|
Operating Current-Max |
0.6 mA
|
0.6 mA
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
Package Shape/Style |
RECTANGULAR
|
RECTANGULAR
|
Sensors/Transducers Type |
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SINGLE TRIP POINT
|
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SINGLE TRIP POINT
|
Supply Voltage-Max |
18 V
|
18 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Surface Mount |
NO
|
NO
|
Temperature Coefficient |
POSITIVE ppm/°C
|
POSITIVE ppm/°C
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Termination Type |
SOLDER
|
SOLDER
|
Base Number Matches |
2
|
2
|
|
|
|