TC58DAM82F1FT00 vs NAND256W3A0CN6E feature comparison

TC58DAM82F1FT00 Toshiba America Electronic Components

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NAND256W3A0CN6E STMicroelectronics

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP STMICROELECTRONICS
Part Package Code TSOP1 TSOP
Package Description TSOP1, 12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-48
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.1.B.1 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0 e3/e6
Length 18.4 mm 18.4 mm
Memory Density 268435456 bit 268435456 bit
Memory IC Type EEPROM FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32MX8 32MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial SERIAL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN/TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 12 mm 12 mm
Base Number Matches 1 1
Access Time-Max 35 ns
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type SLC NAND TYPE

Compare TC58DAM82F1FT00 with alternatives

Compare NAND256W3A0CN6E with alternatives