TC58256AFT vs NAND256W3A0CN1E feature comparison

TC58256AFT Toshiba America Electronic Components

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NAND256W3A0CN1E STMicroelectronics

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP STMICROELECTRONICS
Part Package Code TSOP1 TSOP
Package Description TSOP1, 12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-48
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.1.B.1 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 18.4 mm 18.4 mm
Memory Density 268435456 bit 268435456 bit
Memory IC Type EEPROM FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32MX8 32MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial SERIAL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 12 mm 12 mm
Base Number Matches 1 2
Rohs Code Yes
Access Time-Max 35 ns
JESD-609 Code e3/e6
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN/TIN BISMUTH
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type SLC NAND TYPE

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Compare NAND256W3A0CN1E with alternatives