TC582562AXB vs K9F5608D0D-JCB00 feature comparison

TC582562AXB Toshiba America Electronic Components

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K9F5608D0D-JCB00 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description TFBGA, BGA63,8X12,32 VFBGA,
Pin Count 63 63
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.1.B.1 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 35 ns 30 ns
Command User Interface YES
Data Polling NO
JESD-30 Code R-PBGA-B63 R-PBGA-B63
JESD-609 Code e0
Length 11 mm 11 mm
Memory Density 268435456 bit 268435456 bit
Memory IC Type EEPROM FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Sectors/Size 2K
Number of Terminals 63 63
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 32MX8 32MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA VFBGA
Package Equivalence Code BGA63,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Page Size 512 words
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 2.7 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm 1 mm
Sector Size 16K
Standby Current-Max 0.0001 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V 2.9 V
Supply Voltage-Min (Vsup) 2.7 V 2.4 V
Supply Voltage-Nom (Vsup) 3.3 V 2.65 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit NO
Type NAND TYPE
Width 9 mm 9 mm
Base Number Matches 1 1

Compare TC582562AXB with alternatives

Compare K9F5608D0D-JCB00 with alternatives