TC57256AD-20 vs MSM27256-20AS feature comparison

TC57256AD-20 Toshiba America Electronic Components

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MSM27256-20AS LAPIS Semiconductor Co Ltd

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP LAPIS SEMICONDUCTOR CO LTD
Part Package Code DIP
Package Description 0.600 INCH, WINDOWED, CERDIP-28 DIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown unknown
Access Time-Max 200 ns 200 ns
JESD-30 Code R-GDIP-T28 R-XDIP-T28
JESD-609 Code e0 e0
Length 36.83 mm
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code WDIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 6 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS MOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm
Base Number Matches 1 2
ECCN Code EAR99
HTS Code 8542.32.00.61
I/O Type COMMON
Package Equivalence Code DIP28,.6
Programming Voltage 12.5 V
Supply Current-Max 0.1 mA

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