TC55YEM316AXGN55 vs CY62157CV30LL-55BAI feature comparison

TC55YEM316AXGN55 Toshiba America Electronic Components

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CY62157CV30LL-55BAI Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer TOSHIBA CORP ROCHESTER ELECTRONICS LLC
Part Package Code BGA BGA
Package Description TFBGA, BGA48,6X8,30 6 X 10 MM, 1.20 MM HEIGHT, FBGA-48
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 70 ns 55 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e1
Length 11 mm 10 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX16 512KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 250
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.2 mm 1.2 mm
Standby Voltage-Min 1 V
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 2.2 V 3.3 V
Supply Voltage-Min (Vsup) 1.65 V 2.7 V
Supply Voltage-Nom (Vsup) 2 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8 mm 6 mm
Base Number Matches 1 2

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