TC55WD836FF-150 vs MT58L512L18FS-8.5 feature comparison

TC55WD836FF-150 Toshiba America Electronic Components

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MT58L512L18FS-8.5 Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code QFP QFP
Package Description 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100 PLASTIC, TQFP-100
Pin Count 100 100
Reach Compliance Code unknown unknown
Access Time-Max 3.8 ns 8.5 ns
JESD-30 Code R-PQFP-G100 R-PQFP-G100
JESD-609 Code e0 e0
Length 20 mm 20 mm
Memory Density 9437184 bit 9437184 bit
Memory IC Type STANDARD SRAM CACHE SRAM
Memory Width 36 18
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 262144 words 524288 words
Number of Words Code 256000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX36 512KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.6 mm
Supply Voltage-Max (Vsup) 2.625 V 3.6 V
Supply Voltage-Min (Vsup) 2.375 V 3.135 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm 14 mm
Base Number Matches 1 3
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Additional Feature FLOW-THROUGH ARCHITECTURE
Moisture Sensitivity Level 3

Compare TC55WD836FF-150 with alternatives

Compare MT58L512L18FS-8.5 with alternatives