TC55V16176FF-167 vs MCM69R821AZP4.2 feature comparison

TC55V16176FF-167 Toshiba America Electronic Components

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MCM69R821AZP4.2 Motorola Semiconductor Products

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP MOTOROLA INC
Part Package Code QFP
Package Description LQFP, QFP100,.63X.87 BGA,
Pin Count 100
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.6 ns 5.5 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 167 MHz
I/O Type COMMON
JESD-30 Code R-PQFP-G100 R-PBGA-B119
JESD-609 Code e0 e0
Length 20 mm 22 mm
Memory Density 18874368 bit 4718592 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 100 119
Number of Words 1048576 words 262144 words
Number of Words Code 1000000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX18 256KX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP BGA
Package Equivalence Code QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 2.4 mm
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.42 mA
Supply Voltage-Max (Vsup) 3.465 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS BICMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position QUAD BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 3
Number of Ports 1
Output Enable YES

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