TC55257DFTRI-70L
vs
HY62CT08081E-DG70C
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
SK HYNIX INC
Part Package Code
TSOP
SOIC
Package Description
SOP,
SOP, SOP28,.5
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-PDSO-G28
R-PDSO-G28
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
I/O Type
COMMON
Length
18.39 mm
Output Characteristics
3-STATE
Package Equivalence Code
SOP28,.5
Seated Height-Max
3.1496 mm
Standby Voltage-Min
2 V
Supply Current-Max
0.05 mA
Terminal Pitch
1.27 mm
Width
8.69 mm
Compare TC55257DFTRI-70L with alternatives
Compare HY62CT08081E-DG70C with alternatives