TC551001CFI-85L vs UL62H1708AS1K55G1 feature comparison

TC551001CFI-85L Toshiba America Electronic Components

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UL62H1708AS1K55G1 ZMDI

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code SOIC SOIC
Package Description 0.525 INCH, 1.27 MM PITCH, PLASTIC, SOP-32 SOP,
Pin Count 32 32
Reach Compliance Code unknown compliant
Samacsys Manufacturer Toshiba
Access Time-Max 85 ns 55 ns
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e0 e3
Length 20.6 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX8 128KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.7 mm
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8542.32.00.41
Moisture Sensitivity Level 3

Compare TC551001CFI-85L with alternatives

Compare UL62H1708AS1K55G1 with alternatives