TC551001CFI-85L vs HM62Y8256BLTSI-12 feature comparison

TC551001CFI-85L Toshiba America Electronic Components

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HM62Y8256BLTSI-12 Renesas Electronics Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP RENESAS TECHNOLOGY CORP
Part Package Code SOIC TSOP1
Package Description 0.525 INCH, 1.27 MM PITCH, PLASTIC, SOP-32 TSOP1,
Pin Count 32 32
Reach Compliance Code unknown unknown
Samacsys Manufacturer Toshiba
Access Time-Max 85 ns 120 ns
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e0
Length 20.6 mm 11.8 mm
Memory Density 1048576 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 262144 words
Number of Words Code 128000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX8 256KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 3.3 V
Supply Voltage-Min (Vsup) 4.5 V 2.3 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.7 mm 8 mm
Base Number Matches 2 3
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41

Compare TC551001CFI-85L with alternatives

Compare HM62Y8256BLTSI-12 with alternatives