TC551001CFI-85L vs EDI88130CS25L32C feature comparison

TC551001CFI-85L Toshiba America Electronic Components

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EDI88130CS25L32C Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP MICROSEMI CORP
Part Package Code SOIC QFJ
Package Description 0.525 INCH, 1.27 MM PITCH, PLASTIC, SOP-32 CERAMIC, LCC-32
Pin Count 32 32
Reach Compliance Code unknown unknown
Samacsys Manufacturer Toshiba
Access Time-Max 85 ns 25 ns
JESD-30 Code R-PDSO-G32 R-CQCC-N32
JESD-609 Code e0
Length 20.6 mm 13.97 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX8 128KX8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOP QCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 3.048 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 10.7 mm 11.43 mm
Base Number Matches 2 1
Pbfree Code No
ECCN Code EAR99
HTS Code 8542.32.00.41

Compare TC551001CFI-85L with alternatives

Compare EDI88130CS25L32C with alternatives