TC514258AP-10
vs
KM44C258AP-10
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
DIP
Package Description
DIP,
DIP, DIP20,.3
Pin Count
20
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
STATIC COLUMN
Access Time-Max
100 ns
100 ns
Additional Feature
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
JESD-30 Code
R-PDIP-T20
R-PDIP-T20
JESD-609 Code
e0
e0
Length
24.6 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STATIC COLUMN DRAM
STATIC COLUMN DRAM
Memory Width
4
4
Number of Functions
1
Number of Ports
1
Number of Terminals
20
20
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX4
256KX4
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
512
512
Seated Height-Max
4.4 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
1
Pbfree Code
I/O Type
COMMON
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Package Equivalence Code
DIP20,.3
Standby Current-Max
0.001 A
Supply Current-Max
0.065 mA
Compare TC514258AP-10 with alternatives
Compare KM44C258AP-10 with alternatives