TC4514BP
vs
MC74LCX139MEL
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
ON SEMICONDUCTOR
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP,
|
SOP, SOP16,.3
|
| Pin Count |
24
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
ADDRESS LATCHES
|
|
| Family |
4000/14000/40000
|
LVC/LCX/Z
|
| Input Conditioning |
LATCHED
|
STANDARD
|
| JESD-30 Code |
R-PDIP-T24
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e4
|
| Length |
32 mm
|
10.2 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
4-LINE TO 16-LINE DECODER
|
2-LINE TO 4-LINE DECODER
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
24
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Propagation Delay (tpd) |
970 ns
|
9.3 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.8 mm
|
2.05 mm
|
| Supply Voltage-Max (Vsup) |
18 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.7 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
5.275 mm
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Max I(ol) |
|
0.024 A
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
SOP16,.3
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Supply Current-Max (ICC) |
|
0.01 mA
|
| Prop. Delay@Nom-Sup |
|
6.2 ns
|
|
|
|
Compare TC4514BP with alternatives
Compare MC74LCX139MEL with alternatives