TC4514BP vs MC14514BCP feature comparison

TC4514BP Toshiba America Electronic Components

Buy Now Datasheet

MC14514BCP onsemi

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP ONSEMI
Part Package Code DIP DIP
Package Description DIP, PLASTIC, DIP-24
Pin Count 24 24
Reach Compliance Code unknown not_compliant
Additional Feature ADDRESS LATCHES ADDRESS LATCHES
Family 4000/14000/40000 4000/14000/40000
Input Conditioning LATCHED LATCHED
JESD-30 Code R-PDIP-T24 R-PDIP-T24
JESD-609 Code e0 e0
Length 32 mm 31.75 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 4-LINE TO 16-LINE DECODER 4-LINE TO 16-LINE DECODER
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 970 ns 1100 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.8 mm 5.08 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 2
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer onsemi
Max I(ol) 0.00064 A
Package Equivalence Code DIP24,.6
Peak Reflow Temperature (Cel) 235
Prop. Delay@Nom-Sup 1100 ns
Time@Peak Reflow Temperature-Max (s) 30

Compare TC4514BP with alternatives

Compare MC14514BCP with alternatives