TC4514BP vs HEF4514BP,652 feature comparison

TC4514BP Toshiba America Electronic Components

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HEF4514BP,652 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP, DIP24,.6
Pin Count 24 24
Reach Compliance Code unknown compliant
Additional Feature ADDRESS LATCHES
Family 4000/14000/40000 4000/14000/40000
Input Conditioning LATCHED LATCHED
JESD-30 Code R-PDIP-T24 R-PDIP-T24
JESD-609 Code e0 e2
Length 32 mm 31.7 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 4-LINE TO 16-LINE DECODER 4-LINE TO 16-LINE DECODER
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP24,.6 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 970 ns 550 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.8 mm 5.1 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Manufacturer Package Code SOT101-1
HTS Code 8542.39.00.01
Samacsys Manufacturer NXP
Max I(ol) 0.00035999999999999997 A
Prop. Delay@Nom-Sup 550 ns

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