TC4011UBFN(ELP) vs NLV14011BDG feature comparison

TC4011UBFN(ELP) Toshiba America Electronic Components

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NLV14011BDG onsemi

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Pbfree Code No Yes
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP ONSEMI
Part Package Code SOIC SOIC-14 NB
Package Description SOP, SOIC-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e3
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 110 ns 250 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Manufacturer Package Code 751A-03
Factory Lead Time 2 Days
Samacsys Manufacturer onsemi
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.25
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 250 ns
Schmitt Trigger NO
Screening Level AEC-Q100
Time@Peak Reflow Temperature-Max (s) 30

Compare TC4011UBFN(ELP) with alternatives

Compare NLV14011BDG with alternatives