TC4011BF(TP1) vs HD14093BP feature comparison

TC4011BF(TP1) Toshiba America Electronic Components

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HD14093BP Renesas Electronics Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP RENESAS TECHNOLOGY CORP
Part Package Code SOIC DIP
Package Description 0.300 INCH, PLASTIC, SOIC-14 DIP,
Pin Count 14 14
Reach Compliance Code unknown unknown
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e0
Length 10.3 mm 19.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 200 ns 250 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 5.06 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.3 mm 7.62 mm
Base Number Matches 1 2
HTS Code 8542.39.00.01

Compare TC4011BF(TP1) with alternatives

Compare HD14093BP with alternatives