TC3W01FU
vs
SN74LVC1G29DCURG4
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
SOIC
Package Description
LSSOP,
VSSOP, TSSOP8,.12,20
Pin Count
8
8
Reach Compliance Code
unknown
compliant
Date Of Intro
1993-03-01
Family
HC/UH
LVC/LCX/Z
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e0
e4
Length
2.9 mm
2.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
OTHER DECODER/DRIVER
OTHER DECODER/DRIVER
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
VSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
165 ns
15.8 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.3 mm
0.9 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
1.65 V
Supply Voltage-Nom (Vsup)
4.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
2.8 mm
2 mm
Base Number Matches
1
1
Pbfree Code
ECCN Code
EAR99
HTS Code
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Package Equivalence Code
TSSOP8,.12,20
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
6.1 ns
Time@Peak Reflow Temperature-Max (s)
30
Compare TC3W01FU with alternatives
Compare SN74LVC1G29DCURG4 with alternatives