TC2574-3.3VPA
vs
LM2675MX-3.3/NOPB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP, DIP8,.3
0.150 INCH, PLASTIC, SOIC-8
Pin Count
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Analog IC - Other Type
SWITCHING REGULATOR
SWITCHING REGULATOR
Control Mode
VOLTAGE-MODE
VOLTAGE-MODE
Input Voltage-Max
40 V
40 V
Input Voltage-Min
4.75 V
6.5 V
Input Voltage-Nom
12 V
12 V
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
JESD-609 Code
e3
e3
Length
9.5 mm
4.9 mm
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Current-Max
1.8 A
2.2 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP8,.3
SOP28,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
1.75 mm
Surface Mount
NO
YES
Switcher Configuration
BUCK
BUCK
Switching Frequency-Max
63 kHz
275 kHz
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
3.9 mm
Base Number Matches
3
2
Control Technique
PULSE WIDTH MODULATION
Moisture Sensitivity Level
1
Output Voltage-Nom
3.3 V
Peak Reflow Temperature (Cel)
260
Supply Current-Max (Isup)
3.6 mA
Technology
DMOS
Time@Peak Reflow Temperature-Max (s)
40
Compare TC2574-3.3VPA with alternatives
Compare LM2675MX-3.3/NOPB with alternatives