TC1N758A.TB26
vs
JANTXV1N4622-1
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TAK CHEONG ELECTRONICS HOLDINGS CO LTD
MICROCHIP TECHNOLOGY INC
Part Package Code
DO-35
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
17 Ω
JEDEC-95 Code
DO-35
DO-35
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
250
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Qualified
Reference Voltage-Nom
10 V
3.9 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
20 mA
0.25 mA
Base Number Matches
1
8
Factory Lead Time
20 Weeks
Additional Feature
METALLURGICALLY BONDED
Reference Standard
MIL-19500/435
Compare TC1N758A.TB26 with alternatives
Compare JANTXV1N4622-1 with alternatives