TC1N747D.TB26
vs
1N5227DRL2
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TAK CHEONG ELECTRONICS HOLDINGS CO LTD
MOTOROLA INC
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
O-LALF-W2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
24 Ω
JEDEC-95 Code
DO-35
DO-204AH
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
250
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Reference Voltage-Nom
3.6 V
3.6 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
1%
1%
Working Test Current
20 mA
20 mA
Base Number Matches
1
3
Part Package Code
DO-35
Pin Count
2
Knee Impedance-Max
1700 Ω
Operating Temperature-Min
-65 °C
Qualification Status
Not Qualified
Reverse Current-Max
15 µA
Voltage Temp Coeff-Max
Compare TC1N747D.TB26 with alternatives
Compare 1N5227DRL2 with alternatives