TBP18SA030N vs IDM29751JM/883 feature comparison

TBP18SA030N Texas Instruments

Buy Now Datasheet

IDM29751JM/883 Texas Instruments

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 40 ns 40 ns
JESD-30 Code R-PDIP-T16 R-GDIP-T16
Length 19.305 mm 19.43 mm
Memory Density 256 bit 256 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 32 words 32 words
Number of Words Code 32 32
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 32X8 32X8
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 0.11 mA 0.11 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
Pbfree Code No
JESD-609 Code e0
Output Characteristics 3-STATE
Screening Level 38535Q/M;38534H;883B
Terminal Finish TIN LEAD

Compare TBP18SA030N with alternatives

Compare IDM29751JM/883 with alternatives