TBJA475M010CSLD0023
vs
TCMIA475ATLSR1K2
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
AVX CORP
|
CAL-CHIP ELECTRONICS INC
|
| Package Description |
, 1206
|
CHIP
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8532.21.00.50
|
|
| Capacitance |
4.7 µF
|
4.7 µF
|
| Capacitor Type |
TANTALUM CAPACITOR
|
TANTALUM CAPACITOR
|
| Dielectric Material |
TANTALUM (DRY/SOLID)
|
TANTALUM (DRY/SOLID)
|
| ESR |
5000 mΩ
|
1200 mΩ
|
| Height |
1.6 mm
|
1.6 mm
|
| JESD-609 Code |
e0
|
e3
|
| Length |
3.2 mm
|
3.2 mm
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Negative Tolerance |
20%
|
20%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Shape |
RECTANGULAR PACKAGE
|
|
| Package Style |
SMT
|
SMT
|
| Packing Method |
TR, 13 INCH
|
TR, EMBOSSED PLASTIC, 7 INCH
|
| Polarity |
POLARIZED
|
POLARIZED
|
| Positive Tolerance |
20%
|
20%
|
| Rated (DC) Voltage (URdc) |
10 V
|
10 V
|
| Reference Standard |
MIL-PRF-55365/8
|
|
| Size Code |
1206
|
1206
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Tin/Lead (Sn/Pb) - fused
|
Matte Tin (Sn)
|
| Terminal Shape |
J BEND
|
J BEND
|
| Width |
1.6 mm
|
1.6 mm
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
ESR AND RIPPLE CURRENT IS MEASURED AT 100KHZ
|
| Leakage Current |
|
0.0005 mA
|
| Ripple Current |
|
100 mA
|
| Tan Delta |
|
0.06
|
|
|
|
Compare TBJA475M010CSLD0023 with alternatives
Compare TCMIA475ATLSR1K2 with alternatives