TAZE226J010CESD0845
vs
T429E226J010AC4251WAFL
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
AVX CORP
|
KEMET ELECTRONICS CORP
|
| Package Description |
, 2010
|
, 2010
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Capacitance |
22 µF
|
22 µF
|
| Capacitor Type |
TANTALUM CAPACITOR
|
TANTALUM CAPACITOR
|
| Dielectric Material |
TANTALUM (DRY/SOLID)
|
TANTALUM (DRY/SOLID)
|
| ESR |
2000 mΩ
|
600 mΩ
|
| Height |
1.27 mm
|
1.27 mm
|
| JESD-609 Code |
e0
|
e0
|
| Length |
5.08 mm
|
5.08 mm
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Negative Tolerance |
5%
|
5%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Style |
SMT
|
SMT
|
| Packing Method |
Bulk
|
WAFFLE PACK
|
| Polarity |
POLARIZED
|
POLARIZED
|
| Positive Tolerance |
5%
|
5%
|
| Rated (DC) Voltage (URdc) |
10 V
|
10 V
|
| Reference Standard |
MIL-PRF-55365/11
|
|
| Size Code |
2010
|
2010
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Tin/Lead (Sn/Pb) - hot dipped
|
Tin/Lead (Sn90Pb10)
|
| Terminal Shape |
J BEND
|
J BEND
|
| Width |
2.54 mm
|
2.54 mm
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8532.21.00.50
|
| Additional Feature |
|
ESR AND RIPPLE CURRENT IS MEASURED AT 100KHZ
|
| Leakage Current |
|
0.003 mA
|
| Ripple Current |
|
154.8 mA
|
| Tan Delta |
|
0.08
|
|
|
|
Compare TAZE226J010CESD0845 with alternatives
Compare T429E226J010AC4251WAFL with alternatives