TA75W558FU
vs
TA75W558FU(TE12L,F
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TOSHIBA CORP
|
TOSHIBA CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
LSSOP, TSSOP8,.16
|
LSSOP,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
|
Average Bias Current-Max (IIB) |
0.5 µA
|
0.5 µA
|
Bias Current-Max (IIB) @25C |
0.5 µA
|
|
Common-mode Reject Ratio-Nom |
90 dB
|
90 dB
|
Frequency Compensation |
YES
|
|
Input Offset Voltage-Max |
6000 µV
|
6000 µV
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
Length |
2.9 mm
|
2.9 mm
|
Low-Offset |
NO
|
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LSSOP
|
LSSOP
|
Package Equivalence Code |
TSSOP8,.16
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.3 mm
|
1.3 mm
|
Slew Rate-Nom |
1 V/us
|
1 V/us
|
Supply Current-Max |
6 mA
|
|
Supply Voltage Limit-Max |
18 V
|
18 V
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Unity Gain BW-Nom |
3000
|
3000
|
Voltage Gain-Min |
20000
|
|
Width |
2.8 mm
|
2.8 mm
|
Base Number Matches |
4
|
1
|
Samacsys Manufacturer |
|
Toshiba
|
Neg Supply Voltage Limit-Max |
|
-18 V
|
|
|
|