TA75S393FTE85L vs LM139A/BCA feature comparison

TA75S393FTE85L Toshiba America Electronic Components

Buy Now Datasheet

LM139A/BCA NXP Semiconductors

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SSOP DIP
Package Description LSSOP, TSOP5/6,.11,37 CERAMIC, DIP-14
Pin Count 5 14
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 0.05 µA 0.3 µA
Bias Current-Max (IIB) @25C 0.05 µA
Input Offset Voltage-Max 5000 µV 4000 µV
JESD-30 Code R-PDSO-G5 R-GDIP-T14
JESD-609 Code e0
Length 2.9 mm 19.43 mm
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions 1 4
Number of Terminals 5 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Type OPEN-COLLECTOR OPEN-COLLECTOR
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code LSSOP DIP
Package Equivalence Code TSOP5/6,.11,37
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Response Time-Nom 1300 ns 1300 ns
Seated Height-Max 1.4 mm 5.08 mm
Supply Current-Max 0.8 mA 3 mA
Supply Voltage Limit-Max 36 V 36 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology BIPOLAR BIPOLAR
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.95 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 10
Width 1.6 mm 7.62 mm
Base Number Matches 2 1

Compare TA75S393FTE85L with alternatives

Compare LM139A/BCA with alternatives