TA75902P
vs
LF147J
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TOSHIBA CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP, DIP14,.3
CERAMIC, DIP-14
Pin Count
14
14
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Samacsys Manufacturer
Toshiba
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.15 µA
0.05 µA
Bias Current-Max (IIB) @25C
0.15 µA
0.0002 µA
Common-mode Reject Ratio-Nom
85 dB
100 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
7000 µV
8000 µV
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
JESD-609 Code
e0
e0
Length
19.25 mm
19.304 mm
Low-Offset
NO
NO
Micropower
YES
Neg Supply Voltage Limit-Max
-22 V
Neg Supply Voltage-Nom (Vsup)
-20 V
Number of Functions
4
4
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.45 mm
5.08 mm
Supply Current-Max
1.2 mA
11 mA
Supply Voltage Limit-Max
36 V
22 V
Supply Voltage-Nom (Vsup)
5 V
20 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Voltage Gain-Min
20000
25000
Width
7.62 mm
7.62 mm
Base Number Matches
1
3
Common-mode Reject Ratio-Min
80 dB
Input Offset Current-Max (IIO)
0.025 µA
Low-Bias
YES
Moisture Sensitivity Level
1
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Slew Rate-Min
8 V/us
Slew Rate-Nom
13 V/us
Time@Peak Reflow Temperature-Max (s)
40
Unity Gain BW-Nom
4000
Compare TA75902P with alternatives
Compare LF147J with alternatives