T810-600B
vs
BTA208S-600E
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TO-252
|
TO-252
|
| Package Description |
DPAK-3
|
SMALL OUTLINE, R-PSSO-G2
|
| Pin Count |
3
|
3
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.30.00.80
|
8541.30.00.80
|
| Factory Lead Time |
19 Weeks, 1 Day
|
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Additional Feature |
SENSITIVE GATE
|
SENSITIVE GATE
|
| Case Connection |
MAIN TERMINAL 2
|
MAIN TERMINAL 2
|
| Configuration |
SINGLE
|
SINGLE
|
| Critical Rate of Rise of Off-State Voltage-Min |
50 V/us
|
20 V/us
|
| DC Gate Trigger Current-Max |
10 mA
|
10 mA
|
| DC Gate Trigger Voltage-Max |
1.3 V
|
1.5 V
|
| Holding Current-Max |
15 mA
|
12 mA
|
| JESD-30 Code |
R-PSSO-G2
|
R-PSSO-G2
|
| JESD-609 Code |
e3
|
e3
|
| Leakage Current-Max |
0.01 mA
|
0.5 mA
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RMS On-state Current-Max |
8 A
|
8 A
|
| Repetitive Peak Off-state Voltage |
600 V
|
600 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Device Type |
4 QUADRANT LOGIC LEVEL TRIAC
|
TRIAC
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| JEDEC-95 Code |
|
TO-252
|
|
|
|
Compare T810-600B with alternatives
Compare BTA208S-600E with alternatives