T74LS32C1 vs TC74HC32AFN-TP1 feature comparison

T74LS32C1 STMicroelectronics

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TC74HC32AFN-TP1 Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS TOSHIBA CORP
Part Package Code QLCC SOIC
Package Description QCCJ, SOP,
Pin Count 20 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS HC/UH
JESD-30 Code S-PQCC-J20 R-PDSO-G14
Length 8.9662 mm 8.65 mm
Load Capacitance (CL) 15 pF 50 pF
Logic IC Type OR GATE OR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 20 14
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ SOP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER SMALL OUTLINE
Power Supply Current-Max (ICC) 9.8 mA
Propagation Delay (tpd) 22 ns 19 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.25 V 6 V
Supply Voltage-Min (Vsup) 4.75 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD DUAL
Width 8.9662 mm 3.9 mm
Base Number Matches 1 3
Pbfree Code No
Rohs Code No
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare T74LS32C1 with alternatives

Compare TC74HC32AFN-TP1 with alternatives