T74LS26B1
vs
S54LS03F
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SGS-ATES COMPONENTI ELECTRONICI S P A
PHILIPS SEMICONDUCTORS
Package Description
DIP-14
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T14
R-XDIP-T14
JESD-609 Code
e0
e0
Length
20 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Terminals
14
14
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output Characteristics
OPEN-COLLECTOR
OPEN-COLLECTOR
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
5.1 mm
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
2
3
Max I(ol)
0.004 A
Prop. Delay@Nom-Sup
7.5 ns