T74LS155M1
vs
SN74LS155ADR
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP, SOP16,.25
|
SO-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LS
|
LS
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e4
|
| Length |
9.9 mm
|
9.9 mm
|
| Load Capacitance (CL) |
15 pF
|
15 pF
|
| Logic IC Type |
2-LINE TO 4-LINE DECODER
|
2-LINE TO 4-LINE DECODER
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.25
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Power Supply Current-Max (ICC) |
10 mA
|
10 mA
|
| Propagation Delay (tpd) |
30 ns
|
30 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Additional Feature |
|
USABLE AS 1 TO 8 DEMULTIPLEXER
|
| Max I(ol) |
|
0.008 A
|
| Moisture Sensitivity Level |
|
1
|
| Number of Bits |
|
4
|
| Output Characteristics |
|
TOTEM POLE
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
27 ns
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare T74LS155M1 with alternatives
Compare SN74LS155ADR with alternatives