T74LS12B1 vs JM38510/30006BCA feature comparison

T74LS12B1 STMicroelectronics

Buy Now Datasheet

JM38510/30006BCA Motorola Mobility LLC

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer STMICROELECTRONICS MOTOROLA INC
Part Package Code DIP DIP
Package Description PLASTIC, DIP-14 DIP,
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer STMicroelectronics
Family LS LS
JESD-30 Code R-PDIP-T14 R-GDIP-T14
Load Capacitance (CL) 15 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Characteristics OPEN-COLLECTOR OPEN-COLLECTOR
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 3.3 mA
Propagation Delay (tpd) 28 ns 55 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 5
Length 19.495 mm

Compare T74LS12B1 with alternatives

Compare JM38510/30006BCA with alternatives