T49470X01825KBN
vs
L1XN401825KT65
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
AVX CORP
|
KEMET ELECTRONICS CORP
|
| Package Description |
,
|
,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Factory Lead Time |
40 Weeks
|
|
| Capacitance |
8.2 µF
|
8.2 µF
|
| Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
| Dielectric Material |
CERAMIC
|
CERAMIC
|
| Height |
16.51 mm
|
16.51 mm
|
| JESD-609 Code |
e0
|
e0
|
| Length |
11.2 mm
|
11.18 mm
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
| Multilayer |
Yes
|
Yes
|
| Negative Tolerance |
10%
|
10%
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Style |
PCB Mount
|
PCB Mount
|
| Positive Tolerance |
10%
|
10%
|
| Rated (DC) Voltage (URdc) |
100 V
|
100 V
|
| Reference Standard |
MIL-PRF-49470/1
|
|
| Surface Mount |
NO
|
NO
|
| Temperature Characteristics Code |
BX
|
BX
|
| Temperature Coefficient |
15% ppm/°C
|
15% ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn60Pb40)
|
| Terminal Shape |
FLAT
|
FLAT
|
| Width |
10.8 mm
|
10.8 mm
|
| Base Number Matches |
1
|
1
|
| Samacsys Manufacturer |
|
KEMET
|
| Packing Method |
|
WAFFLE PACK
|
|
|
|