T0345
vs
MC13201FC
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
TEMIC SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
Reach Compliance Code |
unknown
|
unknown
|
Base Number Matches |
2
|
3
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
QFN
|
Package Description |
|
5 X 5 MM, LEAD FREE, PLASTIC, QFN-32
|
Pin Count |
|
32
|
JESD-30 Code |
|
S-PQCC-N32
|
Length |
|
5 mm
|
Moisture Sensitivity Level |
|
3
|
Number of Functions |
|
1
|
Number of Terminals |
|
32
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
HVQCCN
|
Package Shape |
|
SQUARE
|
Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
COMMERCIAL
|
Seated Height-Max |
|
1 mm
|
Supply Voltage-Nom |
|
2.7 V
|
Surface Mount |
|
YES
|
Telecom IC Type |
|
RF AND BASEBAND CIRCUIT
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
NOT SPECIFIED
|
Terminal Form |
|
NO LEAD
|
Terminal Pitch |
|
0.5 mm
|
Terminal Position |
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
5 mm
|
|
|
|